About Our Company
​Launched in 2023 with the goal of developing cutting edge Photonic Technology, LuminoLabs has become a global leader in providing high performance Photonics for AI Photonics, Data Center Interconnect Photonics and Mobility Photonics since its launch in 2023 with the goal of developing new cutting edge Photonic Technologies. LuminoLabs specializes in both Application-Specific and Customer-Specific Photonics packaging and manufacturing technologies.

LuminoLabs’ most popular current products include:
Interconnect FAUs for AI Data Center Photonics such as 1.6THz Transceivers and Co-Packaged Optics, and various Photonic sensors for Land/Sea/Air/Space and Complex Vehicle Mobility. Though specific IPs and know-how’s about efficient  photonics packaging, LuminoLabs delivers specifically customized Photonics Solutions to the customers who are looking for outsourcing top-performance and high-quality possible.
​Expertise in Photonics Packaging
​- Temperature Insensitive Packaging
- Standard Photonics I/O Packaging
- Multi-Fiber Connectivity Packaging
- High PER Packaging
- Specialty Photonics Packaging
                 Multi-Chip Integration
                 Hybrid Integration 
                 Passive Alignment
-  Specialty FAU Packaging
​​                 Lid Recessed FAUs
                 Lidless FAUs
                 Fiber Protrusion FAUs
- Ultra Precision Dicing and Polishing